74HC573N

74HC573N

DIP, DIP20,.3

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  74HC573N

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP20,.3

PACKAGE EQUIVALENCE CODE:  DIP20,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PACKING METHOD:  BULK PACK

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  BROADSIDE VERSION OF 373

FAMILY:  HC/UH

JESD-30 CODE:  R-PDIP-T20

JESD-609 CODE:  E4

LENGTH:  26.73 MM

LOAD CAPACITANCE (CL):  50 PF

LOGIC IC TYPE:  BUS DRIVER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  74HC573N

MAX I(OL):  6 MA

MOISTURE SENSITIVITY LEVEL:  NOT APPLICABLE

NUMBER OF BITS:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  2

NUMBER OF TERMINALS:  20

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP, DIP20,.3

PACKAGE EQUIVALENCE CODE:  DIP20,.3

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PACKING METHOD:  BULK PACK

PART PACKAGE CODE:  DIP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  20

POWER SUPPLIES:  2/6 V

PROP. DELAY@NOM-SUP:  45 NS

PROPAGATION DELAY (TPD):  225 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  4.2 MM

SOURCE URL STATUS CHECK DATE:  2013-06-14 00:00:00

SUBCATEGORY:  FF/LATCHES

SUPPLY VOLTAGE-MAX (VSUP):  6 V

SUPPLY VOLTAGE-MIN (VSUP):  2 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  NO

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  7.62 MM

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