74HCT2G125DP

74HCT2G125DP

TSSOP, TSSOP8,.16

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  74HCT2G125DP

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP8,.16

PACKAGE EQUIVALENCE CODE:  TSSOP8,.16

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

CONTROL TYPE:  ENABLE LOW

FAMILY:  HCT

JESD-30 CODE:  S-PDSO-G8

JESD-609 CODE:  E4

LENGTH:  3 MM

LOGIC IC TYPE:  BUS DRIVER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  74HCT2G125DP

MAX I(OL):  6 MA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF BITS:  1

NUMBER OF FUNCTIONS:  2

NUMBER OF PORTS:  2

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP8,.16

PACKAGE EQUIVALENCE CODE:  TSSOP8,.16

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  SOIC

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  8

POWER SUPPLIES:  5 V

PROP. DELAY@NOM-SUP:  38 NS

PROPAGATION DELAY (TPD):  38 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.1 MM

SUBCATEGORY:  BUS DRIVER/TRANSCEIVERS

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  3 MM

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