BRAND NAME:  NXP SEMICONDUCTOR

FAMILY:  HCT

JESD-30 CODE:  R-PDSO-G6

JESD-609 CODE:  E3

KEYWORDS:  9352 810 35125

LENGTH:  2 MM

LOAD CAPACITANCE (CL):  50 PF

LOGIC IC TYPE:  BUFFER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOT363

MANUFACTURER PART NUMBER:  74HCT2G34GW,125

MAX I(OL):  4 MA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  2

NUMBER OF INPUTS:  1

NUMBER OF TERMINALS:  6

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP6,.08

PACKAGE EQUIVALENCE CODE:  TSSOP6,.08

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PACKING METHOD:  TAPE AND REEL

PART PACKAGE CODE:  TSSOP

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  6

POWER SUPPLIES:  5 V

PROP. DELAY@NOM-SUP:  29 NS

PROPAGATION DELAY (TPD):  29 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SCHMITT TRIGGER:  NO

SEATED HEIGHT-MAX:  1.1 MM

SUBCATEGORY:  GATES

SUPPLY VOLTAGE-MAX (VSUP):  5.5 V

SUPPLY VOLTAGE-MIN (VSUP):  4.5 V

SUPPLY VOLTAGE-NOM (VSUP):  5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  1.25 MM