74LVC1T45GW,125
TSSOP, TSSOP6,.08Call for availability
Mfr Part#: 74LVC1T45GW,125
MANUFACTURER PACKAGE CODE: SOT363
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP6,.08
PACKAGE EQUIVALENCE CODE: TSSOP6,.08
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BRAND NAME: NXP SEMICONDUCTOR
CONTROL TYPE: COMMON CONTROL
COUNT DIRECTION: BIDIRECTIONAL
FAMILY: LVC/LCX/Z
JESD-30 CODE: R-PDSO-G6
JESD-609 CODE: E3
KEYWORDS: 9352 847 51125
LENGTH: 2 MM
LOGIC IC TYPE: BUS TRANSCEIVER
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PACKAGE CODE: SOT363
MANUFACTURER PART NUMBER: 74LVC1T45GW,125
MAX I(OL): 24 MA
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF BITS: 1
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 6
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CHARACTERISTICS: 3-STATE
OUTPUT POLARITY: TRUE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP6,.08
PACKAGE EQUIVALENCE CODE: TSSOP6,.08
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSSOP
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 6
POWER SUPPLIES: 3.3 V
PROPAGATION DELAY (TPD): 23.5 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.1 MM
SUBCATEGORY: BUS DRIVER/TRANSCEIVERS
SUPPLY VOLTAGE-MAX (VSUP): 5.5 V
SUPPLY VOLTAGE-MIN (VSUP): 1.2 V
SUPPLY VOLTAGE-NOM (VSUP): 1.5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: TIN (SN)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
TRANSLATION: 1.8/5V&1.8/5V
WIDTH: 1.25 MM
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