ADDITIONAL FEATURE:  BROADSIDE VERSION OF 373

FAMILY:  LVC/LCX/Z

JESD-30 CODE:  R-PDSO-G20

JESD-609 CODE:  E4

LENGTH:  6.5 MM

LOAD CAPACITANCE (CL):  50 PF

LOGIC IC TYPE:  BUS DRIVER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  74LVC573APW

MAX I(OL):  24 MA

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF BITS:  8

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  2

NUMBER OF TERMINALS:  20

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  3-STATE

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP20,.25

PACKAGE EQUIVALENCE CODE:  TSSOP20,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PACKING METHOD:  TUBE

PART PACKAGE CODE:  TSSOP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  20

POWER SUPPLIES:  3.3 V

PROP. DELAY@NOM-SUP:  8 NS

PROPAGATION DELAY (TPD):  9.5 NS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.1 MM

SUBCATEGORY:  FF/LATCHES

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  1.2 V

SUPPLY VOLTAGE-NOM (VSUP):  2.7 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  AUTOMOTIVE

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  4.4 MM