BZV55-C47,115

BZV55-C47,115

O-LELF-R2

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  BZV55-C47,115

MANUFACTURER PACKAGE CODE:  SOD80C

PACKAGE BODY MATERIAL:  GLASS

PACKAGE DESCRIPTION:  O-LELF-R2

PACKAGE SHAPE:  ROUND

PACKAGE STYLE:  LONG FORM

PART PACKAGE CODE:  MELF

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BRAND NAME:  NXP SEMICONDUCTOR

CASE CONNECTION:  ISOLATED

CONFIGURATION:  SINGLE

DIODE ELEMENT MATERIAL:  SILICON

DIODE TYPE:  ZENER DIODE

DYNAMIC IMPEDANCE-MAX:  170 O

JESD-30 CODE:  O-LELF-R2

JESD-609 CODE:  E3

KEYWORDS:  9336 997 10115

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOD80C

MANUFACTURER PART NUMBER:  BZV55-C47,115

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF ELEMENTS:  1

NUMBER OF TERMINALS:  2

OPERATING TEMPERATURE-MAX:  200 °C

OPERATING TEMPERATURE-MIN:  -65 °C

PACKAGE BODY MATERIAL:  GLASS

PACKAGE DESCRIPTION:  O-LELF-R2

PACKAGE SHAPE:  ROUND

PACKAGE STYLE:  LONG FORM

PART PACKAGE CODE:  MELF

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  2

POLARITY:  UNIDIRECTIONAL

POWER DISSIPATION (MAX):  400 MW

QUALIFICATION STATUS:  NOT QUALIFIED

REFERENCE VOLTAGE-NOM:  47 V

REVERSE CURRENT-MAX:  50 NA

SUBCATEGORY:  VOLTAGE REFERENCE DIODES

SURFACE MOUNT:  YES

TECHNOLOGY:  ZENER

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  WRAP AROUND

TERMINAL POSITION:  END

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

VOLTAGE TEMP COEFF-MAX:  51.8 MV/°C

VOLTAGE TOL-MAX:  5 %

WORKING TEST CURRENT:  2 MA

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*