EM773FHN33

EM773FHN33

HVQCCN

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  EM773FHN33

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVQCCN

PACKAGE DESCRIPTION:  HVQCCN,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

PART PACKAGE CODE:  QFN

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  S-PQCC-N33

LENGTH:  7 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  EM773FHN33

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  33

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVQCCN

PACKAGE DESCRIPTION:  HVQCCN,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

PART PACKAGE CODE:  QFN

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  33

SEATED HEIGHT-MAX:  1 MM

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  1.8 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  7 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROPROCESSOR CIRCUIT

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