LM75BDP

LM75BDP

TSSOP8,.19

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  LM75BDP

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE DESCRIPTION:  TSSOP8,.19

PACKAGE EQUIVALENCE CODE:  TSSOP8,.19

PACKAGE SHAPE/STYLE:  SQUARE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ACCURACY-MAX (CEL):  3 CEL

BODY BREADTH:  3 MM

BODY HEIGHT:  1.1 MM

BODY LENGTH OR DIAMETER:  3 MM

HOUSING:  PLASTIC

JESD-609 CODE:  E4

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  LM75BDP

MOUNTING FEATURE:  SURFACE MOUNT

NUMBER OF BITS:  11

NUMBER OF TERMINALS:  8

OPERATING CURRENT-MAX:  5 MA

OPERATING TEMPERATURE-MAX:  125 °C

OPERATING TEMPERATURE-MIN:  -55 °C

OUTPUT INTERFACE TYPE:  2-WIRE INTERFACE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE DESCRIPTION:  TSSOP8,.19

PACKAGE EQUIVALENCE CODE:  TSSOP8,.19

PACKAGE SHAPE/STYLE:  SQUARE

PBFREE CODE:  YES

POWER SUPPLIES:  3/5 V

SENSORS/TRANSDUCERS TYPE:  TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL

SUBCATEGORY:  OTHER SENSORS

SUPPLY VOLTAGE-MAX:  5.5 V

SUPPLY VOLTAGE-MIN:  2.8 V

SURFACE MOUNT:  YES

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINATION TYPE:  SOLDER

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