LPC1114FHN33/302,5
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Manufactured by:
Mfr Part#: LPC1114FHN33/302,5
PACKAGE / CASE: 32-VQFN EXPOSED PAD
PACKAGING: REEL
STANDARD PACKAGE: 4,000
SUPPLIER DEVICE PACKAGE: 32-HVQFN (7X7)
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CATEGORY: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: I²C, SPI, UART/USART
CORE PROCESSOR: ARM® CORTEX®-M0
CORE SIZE: 32-BIT
DATA CONVERTERS: A/D 8X10B
FAMILY: EMBEDDED - MICROCONTROLLERS
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: LPC1114FHN33/302,5
MANUFACTURER STANDARD LEAD TIME: 12 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 28
OPERATING TEMPERATURE: -40°C ~ 85°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 32-VQFN EXPOSED PAD
PACKAGING: REEL
PERIPHERALS: BROWN-OUT DETECT/RESET, POR, WDT
PROGRAM MEMORY SIZE: 32KB (32K X 8)
PROGRAM MEMORY TYPE: FLASH
RAM SIZE: 8K X 8
SERIES: LPC1100L
SPEED: 50MHZ
STANDARD PACKAGE: 4,000
SUPPLIER DEVICE PACKAGE: 32-HVQFN (7X7)
VOLTAGE - SUPPLY (VCC/VDD): 1.8 V ~ 3.6 V
ALTERNATE PARTS: LPC1114FHN33/301:5 LPC1114FHN33/303,5
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