ADDRESS BUS WIDTH:  20

BIT SIZE:  32

CLOCK FREQUENCY-MAX:  25 MHZ

DAC CHANNELS:  YES

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  16

HAS ADC:  YES

JESD-30 CODE:  S-PBGA-B180

JESD-609 CODE:  E1

LENGTH:  12 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOT-570-2

MANUFACTURER PART NUMBER:  LPC1776FET180

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF I/O LINES:  141

NUMBER OF TERMINALS:  180

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA180,14X14,32

PACKAGE EQUIVALENCE CODE:  BGA180,14X14,32

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  180

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  81920

ROM (WORDS):  262144

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.2 MM

SPEED:  120 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  100 MA

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  2.4 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/SILVER/COPPER (SN/AG/CU)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  12 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC