CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CAN, EBI/EMI, I²C, IRDA, MICROWIRE, SD, SPI, SSI, SSP, UART/USART
CORE PROCESSOR: ARM® CORTEX®-M3
CORE SIZE: 32-BIT
DATA CONVERTERS: A/D 4X10B; D/A 1X10B
DETAILED DESCRIPTION: ARM® CORTEX®-M3 LPC18XX MICROCONTROLLER IC 32-BIT 180MHZ 512KB (512K X 8) FLASH
EEPROM SIZE: 16K X 8
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: LPC1812JET100E
MANUFACTURER STANDARD LEAD TIME: 12 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 49
OPERATING TEMPERATURE: -40°C ~ 105°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 100-TFBGA
PACKAGING: TRAY
PERIPHERALS: BROWN-OUT DETECT/RESET, DMA, I²S, POR, WDT
PROGRAM MEMORY SIZE: 512KB (512K X 8)
PROGRAM MEMORY TYPE: FLASH
RAM SIZE: 104K X 8
SERIES: LPC18XX
SPEED: 180MHZ
STANDARD PACKAGE: 260
VOLTAGE - SUPPLY (VCC/VDD): 2.2 V ~ 3.6 V
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