LPC2144FBD64

LPC2144FBD64

LFQFP, QFP64,.47SQ,20

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  LPC2144FBD64

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP64,.47SQ,20

PACKAGE EQUIVALENCE CODE:  QFP64,.47SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDRESS BUS WIDTH:  0

BIT SIZE:  32

CPU FAMILY:  ARM7

CLOCK FREQUENCY-MAX:  25 MHZ

DAC CHANNELS:  YES

DMA CHANNELS:  NO

EXTERNAL DATA BUS WIDTH:  0

HAS ADC:  YES

JESD-30 CODE:  S-PQFP-G64

JESD-609 CODE:  E3

LENGTH:  10 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  LPC2144FBD64

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF I/O LINES:  45

NUMBER OF TERMINALS:  64

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP64,.47SQ,20

PACKAGE EQUIVALENCE CODE:  QFP64,.47SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PART PACKAGE CODE:  QFP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  64

POWER SUPPLIES:  3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  16384

ROM (WORDS):  131072

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.6 MM

SPEED:  60 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  10 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC

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