LPC2294HBD144
LFQFP, QFP144,.87SQ,20Call for availability
Mfr Part#: LPC2294HBD144
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP144,.87SQ,20
PACKAGE EQUIVALENCE CODE: QFP144,.87SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO REQUIRES 3.3V SUPPLY
ADDRESS BUS WIDTH: 24
BIT SIZE: 32
CPU FAMILY: ARM7
CLOCK FREQUENCY-MAX: 50 MHZ
DAC CHANNELS: NO
DMA CHANNELS: NO
EXTERNAL DATA BUS WIDTH: 32
HAS ADC: YES
JESD-30 CODE: S-PQFP-G144
JESD-609 CODE: E3
LENGTH: 20 MM
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: LPC2294HBD144
NUMBER OF I/O LINES: 112
NUMBER OF TERMINALS: 144
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
PWM CHANNELS: YES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP144,.87SQ,20
PACKAGE EQUIVALENCE CODE: QFP144,.87SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: QFP
PIN COUNT: 144
POWER SUPPLIES: 1.8,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 16384
ROM (WORDS): 262144
ROM PROGRAMMABILITY: FLASH
SEATED HEIGHT-MAX: 1.6 MM
SOURCE URL STATUS CHECK DATE: 2013-06-14 00:00:00
SPEED: 60 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY VOLTAGE-MAX: 1.95 V
SUPPLY VOLTAGE-MIN: 1.65 V
SUPPLY VOLTAGE-NOM: 1.8 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: TIN
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
WIDTH: 20 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROCONTROLLER, RISC
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