ADDRESS BUS WIDTH:  24

BIT SIZE:  32

CLOCK FREQUENCY-MAX:  25 MHZ

DAC CHANNELS:  YES

DMA CHANNELS:  YES

EXTERNAL DATA BUS WIDTH:  32

HAS ADC:  YES

JESD-30 CODE:  S-PBGA-B208

JESD-609 CODE:  E1

LENGTH:  15 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PACKAGE CODE:  SOT-950-1

MANUFACTURER PART NUMBER:  LPC2470FET208

MOISTURE SENSITIVITY LEVEL:  2

NUMBER OF I/O LINES:  160

NUMBER OF TERMINALS:  208

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  208

QUALIFICATION STATUS:  NOT QUALIFIED

ROM PROGRAMMABILITY:  MROM

SEATED HEIGHT-MAX:  1.2 MM

SPEED:  72 MHZ

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/SILVER/COPPER (SN/AG/CU)

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  15 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC