CATEGORY: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB
CORE PROCESSOR: ARM9®
CORE SIZE: 16/32-BIT
DATA CONVERTERS: A/D 24X10B
EEPROM SIZE: 16K X 8
FAMILY: EMBEDDED - MICROCONTROLLERS
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: LPC2929FBD144,551
MANUFACTURER STANDARD LEAD TIME: 12 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 2 (1 YEAR)
NUMBER OF I/O: 104
OPERATING TEMPERATURE: -40°C ~ 85°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 144-LQFP
PACKAGING: TRAY
PERIPHERALS: DMA, POR, PWM, WDT
PROGRAM MEMORY SIZE: 768KB (768K X 8)
PROGRAM MEMORY TYPE: FLASH
RAM SIZE: 56K X 8
SERIES: LPC2900
SPEED: 125MHZ
STANDARD PACKAGE: 60
SUPPLIER DEVICE PACKAGE: 144-LQFP (20X20)
VOLTAGE - SUPPLY (VCC/VDD): 1.71 V ~ 3.6 V
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