CATEGORY: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: EBI/EMI, I²C, MEMORY CARD, SPI, UART/USART, USB OTG
CORE PROCESSOR: ARM9®
CORE SIZE: 16/32-BIT
DATA CONVERTERS: A/D 3X10B
FAMILY: EMBEDDED - MICROCONTROLLERS
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: LPC3180FEL320/01,5
MANUFACTURER STANDARD LEAD TIME: 39 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 55
OPERATING TEMPERATURE: -40°C ~ 85°C (TA)
OSCILLATOR TYPE: EXTERNAL
PACKAGE / CASE: 320-LFBGA
PACKAGING: TRAY
PERIPHERALS: DMA, PWM, WDT
PROGRAM MEMORY TYPE: ROMLESS
RAM SIZE: 64K X 8
SERIES: LPC3100
SPEED: 208MHZ
STANDARD PACKAGE: 160
SUPPLIER DEVICE PACKAGE: 320-LFBGA (13X13)
VOLTAGE - SUPPLY (VCC/VDD): 1.1 V ~ 3.3 V
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