MC56F8346VFVE

MC56F8346VFVE

LFQFP, QFP144,.87SQ,20

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  MC56F8346VFVE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP144,.87SQ,20

PACKAGE EQUIVALENCE CODE:  QFP144,.87SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  ALSO REQUIRES 3.3V SUPPLY

ADDRESS BUS WIDTH:  17

BARREL SHIFTER:  YES

BIT SIZE:  16

BOUNDARY SCAN:  YES

CPU FAMILY:  56800E

CLOCK FREQUENCY-MAX:  120 MHZ

EXTERNAL DATA BUS WIDTH:  16

FORMAT:  FIXED POINT

INTERNAL BUS ARCHITECTURE:  MULTIPLE

JESD-30 CODE:  S-PQFP-G144

JESD-609 CODE:  E3

LENGTH:  20 MM

LOW POWER MODE:  YES

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  MC56F8346VFVE

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF TERMINALS:  144

OPERATING TEMPERATURE-MAX:  105 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LFQFP

PACKAGE DESCRIPTION:  LFQFP, QFP144,.87SQ,20

PACKAGE EQUIVALENCE CODE:  QFP144,.87SQ,20

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE, FINE PITCH

PEAK REFLOW TEMPERATURE (CEL):  260

POWER SUPPLIES:  2.5,3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  12288

ROM (WORDS):  131072

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.6 MM

SPEED:  60 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY VOLTAGE-MAX:  2.75 V

SUPPLY VOLTAGE-MIN:  2.25 V

SUPPLY VOLTAGE-NOM:  2.5 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  500 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  20 MM

UPS/UCS/PERIPHERAL ICS TYPE:  DIGITAL SIGNAL PROCESSOR, OTHER

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