MC56F8346VFVE
LFQFP, QFP144,.87SQ,20Call for availability
Mfr Part#: MC56F8346VFVE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP144,.87SQ,20
PACKAGE EQUIVALENCE CODE: QFP144,.87SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO REQUIRES 3.3V SUPPLY
ADDRESS BUS WIDTH: 17
BARREL SHIFTER: YES
BIT SIZE: 16
BOUNDARY SCAN: YES
CPU FAMILY: 56800E
CLOCK FREQUENCY-MAX: 120 MHZ
EXTERNAL DATA BUS WIDTH: 16
FORMAT: FIXED POINT
INTERNAL BUS ARCHITECTURE: MULTIPLE
JESD-30 CODE: S-PQFP-G144
JESD-609 CODE: E3
LENGTH: 20 MM
LOW POWER MODE: YES
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: MC56F8346VFVE
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF TERMINALS: 144
OPERATING TEMPERATURE-MAX: 105 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP144,.87SQ,20
PACKAGE EQUIVALENCE CODE: QFP144,.87SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PEAK REFLOW TEMPERATURE (CEL): 260
POWER SUPPLIES: 2.5,3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 12288
ROM (WORDS): 131072
ROM PROGRAMMABILITY: FLASH
SEATED HEIGHT-MAX: 1.6 MM
SPEED: 60 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY VOLTAGE-MAX: 2.75 V
SUPPLY VOLTAGE-MIN: 2.25 V
SUPPLY VOLTAGE-NOM: 2.5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: MATTE TIN
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 40
WIDTH: 20 MM
UPS/UCS/PERIPHERAL ICS TYPE: DIGITAL SIGNAL PROCESSOR, OTHER
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