CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: SCI, SPI
CORE PROCESSOR: HC11
CORE SIZE: 8-BIT
DATA CONVERTERS: A/D 8X8B
EEPROM SIZE: 512 X 8
LEAD FREE STATUS / ROHS STATUS: CONTAINS LEAD / ROHS NON-COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MC68HC11F1CFN4
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 30
OPERATING TEMPERATURE: -40°C ~ 85°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 68-LCC (J-LEAD)
PACKAGING: TUBE
PERIPHERALS: POR, WDT
PROGRAM MEMORY TYPE: ROMLESS
RAM SIZE: 1K X 8
SERIES: HC11
SPEED: 4MHZ
STANDARD PACKAGE: 18
SUPPLIER DEVICE PACKAGE: 68-PLCC (25X25)
VOLTAGE - SUPPLY (VCC/VDD): 4.75 V ~ 5.25 V
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