CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: SCI, SPI
CORE PROCESSOR: HC11
CORE SIZE: 8-BIT
LEAD FREE STATUS / ROHS STATUS: CONTAINS LEAD / ROHS NON-COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MC68HC711D3CFN2
MOISTURE SENSITIVITY LEVEL (MSL): 1 (UNLIMITED)
NUMBER OF I/O: 26
OPERATING TEMPERATURE: -40°C ~ 85°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 44-LCC (J-LEAD)
PACKAGING: TUBE
PERIPHERALS: POR, WDT
PROGRAM MEMORY SIZE: 4KB (4K X 8)
PROGRAM MEMORY TYPE: OTP
RAM SIZE: 192 X 8
SERIES: HC11
SPEED: 2MHZ
STANDARD PACKAGE: 26
SUPPLIER DEVICE PACKAGE: 44-PLCC (17.525X17.525)
VOLTAGE - SUPPLY (VCC/VDD): 4.5 V ~ 5.5 V
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