CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: SCI, SPI
CORE PROCESSOR: HC11
CORE SIZE: 8-BIT
DATA CONVERTERS: A/D 8X8B
EEPROM SIZE: 512 X 8
LEAD FREE STATUS / ROHS STATUS: CONTAINS LEAD / ROHS NON-COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MC68HC711E9CFN2
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 38
OPERATING TEMPERATURE: -40°C ~ 85°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 52-LCC (J-LEAD)
PACKAGING: TUBE
PERIPHERALS: POR, WDT
PROGRAM MEMORY SIZE: 12KB (12K X 8)
PROGRAM MEMORY TYPE: OTP
RAM SIZE: 512 X 8
SERIES: HC11
SPEED: 2MHZ
STANDARD PACKAGE: 23
SUPPLIER DEVICE PACKAGE: 52-PLCC (19.1X19.1)
VOLTAGE - SUPPLY (VCC/VDD): 4.5 V ~ 5.5 V
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