MC68MH360ZP25L
Call for availability
Manufactured by:
Mfr Part#: MC68MH360ZP25L
PACKAGE / CASE: 357-BGA
PACKAGING: TRAY
STANDARD PACKAGE: 44
SUPPLIER DEVICE PACKAGE: 357-PBGA (25X25)
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL INTERFACES: SCC, SMC, SPI
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CO-PROCESSORS/DSP: COMMUNICATIONS; CPM
CORE PROCESSOR: CPU32+
ETHERNET: 10 MBPS (1)
GRAPHICS ACCELERATION: NO
LEAD FREE STATUS / ROHS STATUS: CONTAINS LEAD / ROHS NON-COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MC68MH360ZP25L
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF CORES/BUS WIDTH: 1 CORE, 32-BIT
OPERATING TEMPERATURE: 0°C ~ 70°C (TA)
PACKAGE / CASE: 357-BGA
PACKAGING: TRAY
RAM CONTROLLERS: DRAM
SERIES: M683XX
SPEED: 25MHZ
STANDARD PACKAGE: 44
SUPPLIER DEVICE PACKAGE: 357-PBGA (25X25)
VOLTAGE - I/O: 5.0V
Related Products
Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .