CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CAN, I²C, SCI, SPI
CORE PROCESSOR: HCS12
CORE SIZE: 16-BIT
DATA CONVERTERS: A/D 16X10B
EEPROM SIZE: 4K X 8
LEAD FREE STATUS / ROHS STATUS: CONTAINS LEAD / ROHS NON-COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MC9S12DP256BMPV
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 91
OPERATING TEMPERATURE: -40°C ~ 125°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 112-LQFP
PACKAGING: TRAY
PERIPHERALS: PWM, WDT
PROGRAM MEMORY SIZE: 256KB (256K X 8)
PROGRAM MEMORY TYPE: FLASH
RAM SIZE: 12K X 8
SERIES: HCS12
SPEED: 25MHZ
STANDARD PACKAGE: 300
SUPPLIER DEVICE PACKAGE: 112-LQFP (20X20)
VOLTAGE - SUPPLY (VCC/VDD): 2.35 V ~ 5.25 V
ALTERNATE PARTS: MC9S12DP512MPVE
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