MC9S12GC32MPBE
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Manufactured by:
Mfr Part#: MC9S12GC32MPBE
PACKAGE / CASE: 52-LQFP
PACKAGING: TRAY
STANDARD PACKAGE: 160
SUPPLIER DEVICE PACKAGE: 52-LQFP (10X10)
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: EBI/EMI, SCI, SPI
CORE PROCESSOR: HCS12
CORE SIZE: 16-BIT
DATA CONVERTERS: A/D 8X10B
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MC9S12GC32MPBE
MANUFACTURER STANDARD LEAD TIME: 6 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 35
OPERATING TEMPERATURE: -40°C ~ 125°C (TA)
OSCILLATOR TYPE: INTERNAL
PACKAGE / CASE: 52-LQFP
PACKAGING: TRAY
PERIPHERALS: POR, PWM, WDT
PROGRAM MEMORY SIZE: 32KB (32K X 8)
PROGRAM MEMORY TYPE: FLASH
RAM SIZE: 2K X 8
SERIES: HCS12
SPEED: 25MHZ
STANDARD PACKAGE: 160
SUPPLIER DEVICE PACKAGE: 52-LQFP (10X10)
VOLTAGE - SUPPLY (VCC/VDD): 2.35 V ~ 5.5 V
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