Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BASE PART NUMBER: MC9S12XDP512
CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CAN, EBI/EMI, I²C, IRDA, LIN, SCI, SPI
CORE PROCESSOR: HCS12X
CORE SIZE: 16-BIT
DATA CONVERTERS: A/D 24X10B
DETAILED DESCRIPTION: HCS12X HCS12X MICROCONTROLLER IC 16-BIT 80MHZ 512KB (512K X 8) FLASH 144-LQFP (20X20)
EEPROM SIZE: 4K X 8
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MC9S12XDP512MAG
MANUFACTURER STANDARD LEAD TIME: 10 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 119
OPERATING TEMPERATURE: -40°C ~ 125°C (TA)
OSCILLATOR TYPE: EXTERNAL
PACKAGE / CASE: 144-LQFP
PACKAGING: TRAY
PERIPHERALS: LVD, POR, PWM, WDT
PROGRAM MEMORY SIZE: 512KB (512K X 8)
PROGRAM MEMORY TYPE: FLASH
RAM SIZE: 32K X 8
SERIES: HCS12X
SPEED: 80MHZ
STANDARD PACKAGE: 300
SUPPLIER DEVICE PACKAGE: 144-LQFP (20X20)
VOLTAGE - SUPPLY (VCC/VDD): 2.35 V ~ 5.5 V
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