MC9S12XET256VAL

MC9S12XET256VAL

LQFP, QFP112,.87SQ

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  MC9S12XET256VAL

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LQFP

PACKAGE DESCRIPTION:  LQFP, QFP112,.87SQ

PACKAGE EQUIVALENCE CODE:  QFP112,.87SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  IT ALSO REQUIRES 5 V I/O SUPPLY

ADDRESS BUS WIDTH:  0

BIT SIZE:  32

CPU FAMILY:  CPU12

CLOCK FREQUENCY-MAX:  40 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  NO

EXTERNAL DATA BUS WIDTH:  0

HAS ADC:  YES

JESD-30 CODE:  S-PQFP-G112

JESD-609 CODE:  E3

LENGTH:  20 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  MC9S12XET256VAL

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF I/O LINES:  91

NUMBER OF TERMINALS:  112

OPERATING TEMPERATURE-MAX:  105 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  LQFP

PACKAGE DESCRIPTION:  LQFP, QFP112,.87SQ

PACKAGE EQUIVALENCE CODE:  QFP112,.87SQ

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  FLATPACK, LOW PROFILE

PEAK REFLOW TEMPERATURE (CEL):  260

POWER SUPPLIES:  3.3/5 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  16384

ROM (WORDS):  262144

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.6 MM

SPEED:  50 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY VOLTAGE-MAX:  1.98 V

SUPPLY VOLTAGE-MIN:  1.72 V

SUPPLY VOLTAGE-NOM:  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  MATTE TIN

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  20 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER, RISC

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