CATEGORIES: INTEGRATED CIRCUITS (ICS)
CONNECTIVITY: CAN, EBI/EMI, ETHERNET, I²C, SPI, SSI, UART/USART, USB, USB OTG
CORE PROCESSOR: COLDFIRE V3
CORE SIZE: 32-BIT
LEAD FREE STATUS / ROHS STATUS: LEAD FREE / ROHS COMPLIANT
MANUFACTURER: NXP USA INC.
MANUFACTURER PART NUMBER: MCF5329CVM240
MANUFACTURER STANDARD LEAD TIME: 10 WEEKS
MOISTURE SENSITIVITY LEVEL (MSL): 3 (168 HOURS)
NUMBER OF I/O: 94
OPERATING TEMPERATURE: -40°C ~ 85°C (TA)
OSCILLATOR TYPE: EXTERNAL
PACKAGE / CASE: 256-LBGA
PACKAGING: TRAY
PERIPHERALS: DMA, LCD, PWM, WDT
PROGRAM MEMORY TYPE: ROMLESS
RAM SIZE: 32K X 8
SERIES: MCF532X
SPEED: 240MHZ
STANDARD PACKAGE: 450
SUPPLIER DEVICE PACKAGE: 256-MAPBGA
VOLTAGE - SUPPLY (VCC/VDD): 1.4 V ~ 3.6 V
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