ADDITIONAL INTERFACES:  1-WIRE, AC'97, I²C, I²S, MMC/SD, SPI, SSI, UART

CATEGORIES:  INTEGRATED CIRCUITS (ICS)

CO-PROCESSORS/DSP:  MULTIMEDIA; NEON? SIMD

CORE PROCESSOR:  ARM® CORTEX®-A8

DISPLAY & INTERFACE CONTROLLERS:  KEYPAD, LCD

ETHERNET:  10/100 MBPS (1)

EXPANDED DESCRIPTION:  ARM® CORTEX®-A8 MICROPROCESSOR IC I.MX51 1 CORE, 32-BIT 800MHZ 529-BGA CASE 2017 (19X19)

GRAPHICS ACCELERATION:  NO

LEAD FREE STATUS / ROHS STATUS:  LEAD FREE / ROHS COMPLIANT

MANUFACTURER:  NXP USA INC.

MANUFACTURER PART NUMBER:  MCIMX512DJM8C

MANUFACTURER STANDARD LEAD TIME:  15 WEEKS

MOISTURE SENSITIVITY LEVEL (MSL):  3 (168 HOURS)

NUMBER OF CORES/BUS WIDTH:  1 CORE, 32-BIT

OPERATING TEMPERATURE:  -20°C ~ 85°C (TC)

PACKAGE / CASE:  529-LFBGA

PACKAGING:  TRAY

RAM CONTROLLERS:  LPDDR, DDR2

SECURITY FEATURES:  ARM TZ, BOOT SECURITY, CRYPTOGRAPHY, RTIC, SECURE FUSEBOX, SECURE JTAG, SECURE MEMORY, SECURE RTC

SERIES:  I.MX51

SPEED:  800MHZ

STANDARD PACKAGE:  84

SUPPLIER DEVICE PACKAGE:  529-BGA CASE 2017 (19X19)

USB:  USB 2.0 (3), USB 2.0 + PHY (1)

VOLTAGE - I/O:  1.2V, 1.875V, 2.775V, 3.0V