P1010NSE5HFB

BGA425,23X23,32

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Manufactured by:

Mfr Part#: P1010NSE5HFB

PACKAGE BODY MATERIAL: PLASTIC/EPOXY

PACKAGE DESCRIPTION: , BGA425,23X23,32

PACKAGE EQUIVALENCE CODE: BGA425,23X23,32

Availability

Qty in Stock: Call for availability
Min. Order Qty: 1

SPECIFICATION

BIT SIZE: 32

MANUFACTURER: NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER: P1010NSE5HFB

MOISTURE SENSITIVITY LEVEL: 3

NUMBER OF TERMINALS: 425

PACKAGE BODY MATERIAL: PLASTIC/EPOXY

PACKAGE DESCRIPTION: , BGA425,23X23,32

PACKAGE EQUIVALENCE CODE: BGA425,23X23,32

POWER SUPPLIES: 1 V

QUALIFICATION STATUS: NOT QUALIFIED

SPEED: 800 MHZ

SUBCATEGORY: MICROPROCESSORS

SUPPLY VOLTAGE-NOM: 1 V

SURFACE MOUNT: YES

TECHNOLOGY: CMOS

UPS/UCS/PERIPHERAL ICS TYPE: MICROPROCESSOR, RISC

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