P89LPC921FDH

P89LPC921FDH

TSSOP, TSSOP20,.25

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  P89LPC921FDH

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP20,.25

PACKAGE EQUIVALENCE CODE:  TSSOP20,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  OPERATES AT 2.4V MINIMUM SUPPLY @ 12 MHZ

ADDRESS BUS WIDTH:  0

BIT SIZE:  8

CPU FAMILY:  8051

CLOCK FREQUENCY-MAX:  18 MHZ

DAC CHANNELS:  NO

DMA CHANNELS:  NO

EXTERNAL DATA BUS WIDTH:  0

HAS ADC:  NO

JESD-30 CODE:  R-PDSO-G20

JESD-609 CODE:  E4

LENGTH:  6.5 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  P89LPC921FDH

MOISTURE SENSITIVITY LEVEL:  2

NUMBER OF I/O LINES:  18

NUMBER OF TERMINALS:  20

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PWM CHANNELS:  YES

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP20,.25

PACKAGE EQUIVALENCE CODE:  TSSOP20,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  20

POWER SUPPLIES:  2.5/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

RAM (BYTES):  256

ROM (WORDS):  4096

ROM PROGRAMMABILITY:  FLASH

SEATED HEIGHT-MAX:  1.1 MM

SOURCE URL STATUS CHECK DATE:  2013-06-14 00:00:00

SPEED:  18 MHZ

SUBCATEGORY:  MICROCONTROLLERS

SUPPLY CURRENT-MAX:  18 MA

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  4.4 MM

UPS/UCS/PERIPHERAL ICS TYPE:  MICROCONTROLLER

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