P89LPC933FDH
TSSOP, TSSOP28,.25Call for availability
Mfr Part#: P89LPC933FDH
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP28,.25
PACKAGE EQUIVALENCE CODE: TSSOP28,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO OPERATES BETWEEN 2.4 V AT 12 MHZ
ADDRESS BUS WIDTH: 0
BIT SIZE: 8
CPU FAMILY: 8051
CLOCK FREQUENCY-MAX: 18 MHZ
DAC CHANNELS: YES
DMA CHANNELS: NO
EXTERNAL DATA BUS WIDTH: 0
HAS ADC: YES
JESD-30 CODE: R-PDSO-G28
JESD-609 CODE: E4
LENGTH: 9.7 MM
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: P89LPC933FDH
MOISTURE SENSITIVITY LEVEL: 2
NUMBER OF I/O LINES: 26
NUMBER OF TERMINALS: 28
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PWM CHANNELS: YES
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP28,.25
PACKAGE EQUIVALENCE CODE: TSSOP28,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSSOP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 28
POWER SUPPLIES: 2.5/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 256
ROM (WORDS): 4096
ROM PROGRAMMABILITY: FLASH
SEATED HEIGHT-MAX: 1.1 MM
SPEED: 18 MHZ
SUBCATEGORY: MICROCONTROLLERS
SUPPLY CURRENT-MAX: 18 MA
SUPPLY VOLTAGE-MAX: 3.6 V
SUPPLY VOLTAGE-MIN: 3 V
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: NICKEL/PALLADIUM/GOLD (NI/PD/AU)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 4.4 MM
UPS/UCS/PERIPHERAL ICS TYPE: MICROCONTROLLER
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