PCA9545ABS

PCA9545ABS

HVQCCN

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  PCA9545ABS

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVQCCN

PACKAGE DESCRIPTION:  HVQCCN,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

PART PACKAGE CODE:  QFN

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  ALSO OPERATES WITH 4.5 TO 5.5V SUPPLY

FAMILY:  9545

JESD-30 CODE:  S-PQCC-N20

JESD-609 CODE:  E4

LENGTH:  5 MM

LOGIC IC TYPE:  MULTIPLEXER

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  PCA9545ABS

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF FUNCTIONS:  1

NUMBER OF INPUTS:  4

NUMBER OF OUTPUTS:  1

NUMBER OF TERMINALS:  20

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT CHARACTERISTICS:  OPEN-DRAIN

OUTPUT POLARITY:  TRUE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HVQCCN

PACKAGE DESCRIPTION:  HVQCCN,

PACKAGE SHAPE:  SQUARE

PACKAGE STYLE:  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

PART PACKAGE CODE:  QFN

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  20

PROPAGATION DELAY (TPD):  300 PS

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1 MM

SUPPLY VOLTAGE-MAX (VSUP):  3.6 V

SUPPLY VOLTAGE-MIN (VSUP):  2.3 V

SUPPLY VOLTAGE-NOM (VSUP):  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINAL FORM:  NO LEAD

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  QUAD

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  5 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*