PLS103F
DIP, DIP28,.6Call for availability
Manufactured by:
Mfr Part#: PLS103F
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: DIP
PACKAGE DESCRIPTION: DIP, DIP28,.6
PACKAGE EQUIVALENCE CODE: DIP28,.6
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ARCHITECTURE: PAD-TYPE
JESD-30 CODE: R-XDIP-T28
JESD-609 CODE: E0
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: PLS103F
NUMBER OF INPUTS: 16
NUMBER OF OUTPUTS: 9
NUMBER OF PRODUCT TERMS: 9
NUMBER OF TERMINALS: 28
OPERATING TEMPERATURE-MAX: 70 °C
OPERATING TEMPERATURE-MIN: 0 °C
PACKAGE BODY MATERIAL: CERAMIC
PACKAGE CODE: DIP
PACKAGE DESCRIPTION: DIP, DIP28,.6
PACKAGE EQUIVALENCE CODE: DIP28,.6
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: IN-LINE
POWER SUPPLIES: 5 V
PROGRAMMABLE LOGIC TYPE: OT PLD
QUALIFICATION STATUS: NOT QUALIFIED
SUBCATEGORY: PROGRAMMABLE LOGIC DEVICES
SUPPLY VOLTAGE-NOM: 5 V
SURFACE MOUNT: NO
TECHNOLOGY: TTL
TEMPERATURE GRADE: COMMERCIAL
TERMINAL FINISH: TIN/LEAD (SN/PB)
TERMINAL FORM: THROUGH-HOLE
TERMINAL PITCH: 2.54 MM
TERMINAL POSITION: DUAL
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