S912XD256F1MAL
QFP, QFP112,.87SQCall for availability
Manufactured by:
Mfr Part#: S912XD256F1MAL
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP112,.87SQ
PACKAGE EQUIVALENCE CODE: QFP112,.87SQ
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BIT SIZE: 16
CPU FAMILY: CPU12
JESD-30 CODE: S-PQFP-G112
JESD-609 CODE: E3
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: S912XD256F1MAL
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF TERMINALS: 112
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: QFP
PACKAGE DESCRIPTION: QFP, QFP112,.87SQ
PACKAGE EQUIVALENCE CODE: QFP112,.87SQ
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK
POWER SUPPLIES: 2.5,5 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 14336
ROM (WORDS): 262144
ROM PROGRAMMABILITY: FLASH
SPEED: 40 MHZ
SUBCATEGORY: MICROCONTROLLERS
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: MATTE TIN (SN)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 635 ΜM
TERMINAL POSITION: QUAD
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