S9S08QD2J1MSCR
SOP, SOP8,.25Call for availability
Manufactured by:
Mfr Part#: S9S08QD2J1MSCR
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SOP
PACKAGE DESCRIPTION: SOP, SOP8,.25
PACKAGE EQUIVALENCE CODE: SOP8,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
BIT SIZE: 8
JESD-30 CODE: R-PDSO-G8
JESD-609 CODE: E3
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: S9S08QD2J1MSCR
MOISTURE SENSITIVITY LEVEL: 3
NUMBER OF TERMINALS: 8
OPERATING TEMPERATURE-MAX: 125 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: SOP
PACKAGE DESCRIPTION: SOP, SOP8,.25
PACKAGE EQUIVALENCE CODE: SOP8,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE
PEAK REFLOW TEMPERATURE (CEL): 260
POWER SUPPLIES: 3/5 V
QUALIFICATION STATUS: NOT QUALIFIED
RAM (BYTES): 128
ROM (WORDS): 2048
ROM PROGRAMMABILITY: FLASH
SCREENING LEVEL: AEC-Q100
SPEED: 16 MHZ
SUBCATEGORY: MICROCONTROLLERS
SURFACE MOUNT: YES
TEMPERATURE GRADE: AUTOMOTIVE
TERMINAL FINISH: MATTE TIN
TERMINAL FORM: GULL WING
TERMINAL PITCH: 1.27 MM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 40
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