SC16C554DBIB64
LFQFP, QFP64,.47SQ,20Call for availability
Mfr Part#: SC16C554DBIB64
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP64,.47SQ,20
PACKAGE EQUIVALENCE CODE: QFP64,.47SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: QFP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: ALSO OPERATES AT 2.5V AND 5V SUPPLY
ADDRESS BUS WIDTH: 3
BOUNDARY SCAN: NO
CLOCK FREQUENCY-MAX: 80 MHZ
COMMUNICATION PROTOCOL: ASYNC, BIT
DATA TRANSFER RATE-MAX: 0.625 MBPS
EXTERNAL DATA BUS WIDTH: 8
JESD-30 CODE: S-PQFP-G64
JESD-609 CODE: E3
LENGTH: 10 MM
LOW POWER MODE: NO
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: SC16C554DBIB64
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF SERIAL I/OS: 4
NUMBER OF TERMINALS: 64
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: LFQFP
PACKAGE DESCRIPTION: LFQFP, QFP64,.47SQ,20
PACKAGE EQUIVALENCE CODE: QFP64,.47SQ,20
PACKAGE SHAPE: SQUARE
PACKAGE STYLE: FLATPACK, LOW PROFILE, FINE PITCH
PART PACKAGE CODE: QFP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 64
POWER SUPPLIES: 2.5/5 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.6 MM
SUBCATEGORY: SERIAL IO/COMMUNICATION CONTROLLERS
SUPPLY VOLTAGE-MAX: 3.63 V
SUPPLY VOLTAGE-MIN: 2.97 V
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN (SN)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: QUAD
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 10 MM
UPS/UCS/PERIPHERAL ICS TYPE: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
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