SC16IS740IPW
TSSOP, TSSOP16,.25Call for availability
Mfr Part#: SC16IS740IPW
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP16,.25
PACKAGE EQUIVALENCE CODE: TSSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: CAN ALSO OPERATES AT 2.5 V SUPPLY
ADDRESS BUS WIDTH: 2
BOUNDARY SCAN: NO
CLOCK FREQUENCY-MAX: 80 MHZ
COMMUNICATION PROTOCOL: ASYNC, BIT
DATA ENCODING/DECODING METHOD: NRZ
DATA TRANSFER RATE-MAX: 0.625 MBPS
EXTERNAL DATA BUS WIDTH: 0
JESD-30 CODE: R-PDSO-G16
JESD-609 CODE: E4
LENGTH: 5 MM
LOW POWER MODE: YES
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: SC16IS740IPW
MOISTURE SENSITIVITY LEVEL: 1
NUMBER OF SERIAL I/OS: 1
NUMBER OF TERMINALS: 16
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP16,.25
PACKAGE EQUIVALENCE CODE: TSSOP16,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PART PACKAGE CODE: TSSOP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 16
POWER SUPPLIES: 2.5/3.3 V
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.1 MM
SUBCATEGORY: SERIAL IO/COMMUNICATION CONTROLLERS
SUPPLY VOLTAGE-MAX: 3.6 V
SUPPLY VOLTAGE-MIN: 3 V
SUPPLY VOLTAGE-NOM: 3.3 V
SURFACE MOUNT: YES
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: NICKEL/PALLADIUM/GOLD (NI/PD/AU)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 4.4 MM
UPS/UCS/PERIPHERAL ICS TYPE: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
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