SC16IS750IPW

SC16IS750IPW

TSSOP, TSSOP24,.25

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  SC16IS750IPW

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP24,.25

PACKAGE EQUIVALENCE CODE:  TSSOP24,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  CAN ALSO OPERATES AT 2.5 V SUPPLY

ADDRESS BUS WIDTH:  2

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  80 MHZ

COMMUNICATION PROTOCOL:  ASYNC, BIT

DATA ENCODING/DECODING METHOD:  NRZ

DATA TRANSFER RATE-MAX:  0.625 MBPS

EXTERNAL DATA BUS WIDTH:  0

JESD-30 CODE:  R-PDSO-G24

JESD-609 CODE:  E4

LENGTH:  7.8 MM

LOW POWER MODE:  YES

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  SC16IS750IPW

MOISTURE SENSITIVITY LEVEL:  1

NUMBER OF SERIAL I/OS:  1

NUMBER OF TERMINALS:  24

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP, TSSOP24,.25

PACKAGE EQUIVALENCE CODE:  TSSOP24,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  24

POWER SUPPLIES:  2.5/3.3 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.1 MM

SUBCATEGORY:  SERIAL IO/COMMUNICATION CONTROLLERS

SUPPLY VOLTAGE-MAX:  3.6 V

SUPPLY VOLTAGE-MIN:  3 V

SUPPLY VOLTAGE-NOM:  3.3 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  NICKEL/PALLADIUM/GOLD (NI/PD/AU)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  4.4 MM

UPS/UCS/PERIPHERAL ICS TYPE:  SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

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