TDA8356

TDA8356

SIP, SIP9,.1

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  TDA8356

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SIP

PACKAGE DESCRIPTION:  SIP, SIP9,.1

PACKAGE EQUIVALENCE CODE:  SIP9,.1

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  SIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BLANKING OUTPUT:  NO

CONSUMER IC TYPE:  VERTICAL DEFLECTION IC

JESD-30 CODE:  R-PSIP-T9

JESD-609 CODE:  E3

LENGTH:  23.8 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  TDA8356

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  9

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  -25 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SIP

PACKAGE DESCRIPTION:  SIP, SIP9,.1

PACKAGE EQUIVALENCE CODE:  SIP9,.1

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  SIP

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  245

PIN COUNT:  9

POWER SUPPLIES:  9/25 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  14.2 MM

SUBCATEGORY:  DEFLECTION ICS

SUPPLY VOLTAGE-MAX (VSUP):  25 V

SUPPLY VOLTAGE-MIN (VSUP):  9 V

SURFACE MOUNT:  NO

TECHNOLOGY:  BIPOLAR

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FINISH:  MATTE TIN (SN)

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  SINGLE

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  4.4 MM

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