TDA8954TH

TDA8954TH

HSSOP

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  TDA8954TH

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HSSOP

PACKAGE DESCRIPTION:  HSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BANDWIDTH-NOM:  20 KHZ

CONSUMER IC TYPE:  AUDIO AMPLIFIER

GAIN:  30 DB

HARMONIC DISTORTION:  10 %

JESD-30 CODE:  R-PDSO-G24

LENGTH:  15.9 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  TDA8954TH

NUMBER OF CHANNELS:  2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  24

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

OUTPUT POWER-NOM:  235 W

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  HSSOP

PACKAGE DESCRIPTION:  HSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

PART PACKAGE CODE:  SOIC

PIN COUNT:  24

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  3.5 MM

SUPPLY VOLTAGE-MAX (VSUP):  42.5 V

SUPPLY VOLTAGE-MIN (VSUP):  12.5 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1 MM

TERMINAL POSITION:  DUAL

WIDTH:  11 MM

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