TEA1067/C2

TEA1067/C2

DIP

Call for availability

Manufactured by:

NEXPERIA

Mfr Part#:  TEA1067/C2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

JESD-30 CODE:  R-PDIP-T18

LENGTH:  21.6 MM

MANUFACTURER:  NXP SEMICONDUCTORS

MANUFACTURER PART NUMBER:  TEA1067/C2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  18

OPERATING TEMPERATURE-MAX:  75 °C

OPERATING TEMPERATURE-MIN:  -25 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  DIP

PACKAGE DESCRIPTION:  DIP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  IN-LINE

PART PACKAGE CODE:  DIP

PIN COUNT:  18

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  4.7 MM

SUPPLY VOLTAGE-NOM:  2.8 V

SURFACE MOUNT:  NO

TECHNOLOGY:  BIPOLAR

TELECOM IC TYPE:  TELEPHONE SPEECH CKT

TEMPERATURE GRADE:  COMMERCIAL EXTENDED

TERMINAL FORM:  THROUGH-HOLE

TERMINAL PITCH:  2.54 MM

TERMINAL POSITION:  DUAL

WIDTH:  7.62 MM

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