TEA5761UK
3.50 X 3.50 MM, 0.60 MM HEIGHT, WLCSP-34Call for availability
Mfr Part#: TEA5761UK
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VFBGA
PACKAGE DESCRIPTION: 3.50 X 3.50 MM, 0.60 MM HEIGHT, WLCSP-34
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
CONSUMER IC TYPE: AUDIO SINGLE CHIP RECEIVER
DEMODULATION TYPE: FM
HARMONIC DISTORTION: 0.9 %
JESD-30 CODE: R-PBGA-B34
LENGTH: 3.55 MM
MANUFACTURER: NXP SEMICONDUCTORS
MANUFACTURER PART NUMBER: TEA5761UK
NUMBER OF FUNCTIONS: 1
NUMBER OF TERMINALS: 34
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -20 °C
OUTPUT VOLTAGE-NOM (FM): 75 MV
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: VFBGA
PACKAGE DESCRIPTION: 3.50 X 3.50 MM, 0.60 MM HEIGHT, WLCSP-34
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, VERY THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
PIN COUNT: 34
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 640 ΜM
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 2.4 V
SURFACE MOUNT: YES
TEMPERATURE GRADE: COMMERCIAL EXTENDED
TERMINAL FORM: BALL
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: BOTTOM
WIDTH: 3.55 MM
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