M36W0R6040T0ZAQT

M36W0R6040T0ZAQT

TFBGA

Call for availability

Manufactured by:

NUMONYX

Mfr Part#:  M36W0R6040T0ZAQT

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  PSRAM IS ORGANIZED AS 1M X 16

JESD-30 CODE:  R-PBGA-B88

JESD-609 CODE:  E0

LENGTH:  10 MM

MANUFACTURER:  NUMONYX MEMORY SOLUTIONS

MANUFACTURER PART NUMBER:  M36W0R6040T0ZAQT

MEMORY DENSITY:  67.1089 MBIT

MEMORY IC TYPE:  MEMORY CIRCUIT

MEMORY WIDTH:  16

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  88

NUMBER OF WORDS:  4.1943 M

NUMBER OF WORDS CODE:  4000000

OPERATING MODE:  ASYNCHRONOUS

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -30 °C

ORGANIZATION:  4MX16

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  NOT SPECIFIED

PIN COUNT:  88

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  1.95 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  OTHER

TERMINAL FINISH:  TIN LEAD

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  NOT SPECIFIED

WIDTH:  8 MM

Related Products

Please complete form below with your request and a sales representative will contact you shortly. If you have a BOM that needs quoted, please email it to sales@southelectronics.com, or call (334) 458-0070 to speak to a representative .

* Denotes required field
Mfg Part Number * Manufacturer Quantity* Target Price (ea) USD Need Parts By

Contact Information:Comments:
Company Name:*
Company Type:
Contact Name:*
Phone:
Email:*