B250W48A106XXG

B250W48A106XXG

VFBGA

Call for availability

Manufactured by:

ON SEMICONDUCTOR

Mfr Part#:  B250W48A106XXG

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ADDITIONAL FEATURE:  IT ALSO OPERATES AT NOMINAL 1.25V

ADDRESS BUS WIDTH:  0

BARREL SHIFTER:  YES

BOUNDARY SCAN:  NO

CLOCK FREQUENCY-MAX:  50 MHZ

EXTERNAL DATA BUS WIDTH:  0

FORMAT:  FIXED POINT

INTERNAL BUS ARCHITECTURE:  MULTIPLE

JESD-30 CODE:  R-PBGA-B128

LENGTH:  2.6 MM

LOW POWER MODE:  YES

MANUFACTURER:  ON SEMICONDUCTOR

MANUFACTURER PART NUMBER:  B250W48A106XXG

NUMBER OF TERMINALS:  128

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  VFBGA

PACKAGE DESCRIPTION:  VFBGA,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PIN COUNT:  128

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  924 ΜM

SUPPLY VOLTAGE-MAX:  2 V

SUPPLY VOLTAGE-MIN:  900 MV

SUPPLY VOLTAGE-NOM:  1.8 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  400 ΜM

TERMINAL POSITION:  BOTTOM

WIDTH:  3.81 MM

UPS/UCS/PERIPHERAL ICS TYPE:  DIGITAL SIGNAL PROCESSOR, MIXED

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