FPF2281BUCX-F130

FPF2281BUCX-F130

Call for availability

Manufactured by:

ON SEMICONDUCTOR

Mfr Part#:  FPF2281BUCX-F130

MANUFACTURER PACKAGE CODE:  567QX

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FBGA

PACKAGE EQUIVALENCE CODE:  BGA12,3X4,16

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, FINE PITCH

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

BRAND NAME:  ON SEMICONDUCTOR

DRIVER NUMBER OF BITS:  1

JESD-30 CODE:  R-PBGA-B12

MANUFACTURER:  ON SEMICONDUCTOR

MANUFACTURER PACKAGE CODE:  567QX

MANUFACTURER PART NUMBER:  FPF2281BUCX-F130

NUMBER OF TERMINALS:  12

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  FBGA

PACKAGE EQUIVALENCE CODE:  BGA12,3X4,16

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, FINE PITCH

PBFREE CODE:  YES

POWER SUPPLIES:  2.5/13.5 V

QUALIFICATION STATUS:  NOT QUALIFIED

SUBCATEGORY:  PERIPHERAL DRIVERS

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FORM:  BALL

TERMINAL PITCH:  400 ΜM

TERMINAL POSITION:  BOTTOM

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