MC33077DG

MC33077DG

SOP, SOP8,.25

Call for availability

Manufactured by:

ON SEMICONDUCTOR

Mfr Part#:  MC33077DG

MANUFACTURER PACKAGE CODE:  751-07

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PACKING METHOD:  RAIL

PART PACKAGE CODE:  SOIC

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

AMPLIFIER TYPE:  OPERATIONAL AMPLIFIER

ARCHITECTURE:  VOLTAGE-FEEDBACK

AVERAGE BIAS CURRENT-MAX (IIB):  1.2 ΜA

BIAS CURRENT-MAX (IIB) @25C:  1 ΜA

BRAND NAME:  ON SEMICONDUCTOR

COMMON-MODE REJECT RATIO-NOM:  107 DB

FREQUENCY COMPENSATION:  YES

INPUT OFFSET VOLTAGE-MAX:  1.5 MV

JESD-30 CODE:  R-PDSO-G8

JESD-609 CODE:  E3

LENGTH:  4.9 MM

LOW-OFFSET:  NO

MANUFACTURER:  ON SEMICONDUCTOR

MANUFACTURER PACKAGE CODE:  751-07

MANUFACTURER PART NUMBER:  MC33077DG

NEG SUPPLY VOLTAGE LIMIT-MAX:  -18 V

NEG SUPPLY VOLTAGE-NOM (VSUP):  -15 V

NUMBER OF FUNCTIONS:  2

NUMBER OF TERMINALS:  8

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  SOP

PACKAGE DESCRIPTION:  SOP, SOP8,.25

PACKAGE EQUIVALENCE CODE:  SOP8,.25

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE

PACKING METHOD:  RAIL

PART PACKAGE CODE:  SOIC

PBFREE CODE:  YES

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  8

POWER SUPPLIES:  +-15 V

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.75 MM

SLEW RATE-MIN:  8 V/US

SLEW RATE-NOM:  11 V/US

SUBCATEGORY:  OPERATIONAL AMPLIFIER

SUPPLY CURRENT-MAX:  4.8 MA

SUPPLY VOLTAGE LIMIT-MAX:  18 V

SUPPLY VOLTAGE-NOM (VSUP):  15 V

SURFACE MOUNT:  YES

TECHNOLOGY:  BIPOLAR

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN (SN)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  1.27 MM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

UNITY GAIN BW-NOM:  7.5 MHZ

VOLTAGE GAIN-MIN:  125000

WIDTH:  3.9 MM

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