MC33560ADTBR2

MC33560ADTBR2

TSSOP

Call for availability

Manufactured by:

ON SEMICONDUCTOR

Mfr Part#:  MC33560ADTBR2

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

Availability

  • Qty in Stock: Call for availability

  • Min. Order Qty: 1

SPECIFICATION

ANALOG IC - OTHER TYPE:  ANALOG CIRCUIT

JESD-30 CODE:  R-PDSO-G24

JESD-609 CODE:  E0

LENGTH:  7.8 MM

MANUFACTURER:  ON SEMICONDUCTOR

MANUFACTURER PART NUMBER:  MC33560ADTBR2

NUMBER OF FUNCTIONS:  1

NUMBER OF TERMINALS:  24

OPERATING TEMPERATURE-MAX:  85 °C

OPERATING TEMPERATURE-MIN:  -40 °C

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TSSOP

PACKAGE DESCRIPTION:  TSSOP,

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

PART PACKAGE CODE:  TSSOP

PEAK REFLOW TEMPERATURE (CEL):  240

PIN COUNT:  24

QUALIFICATION STATUS:  NOT QUALIFIED

SEATED HEIGHT-MAX:  1.2 MM

SUPPLY VOLTAGE-MAX (VSUP):  6.6 V

SUPPLY VOLTAGE-MIN (VSUP):  1.8 V

SUPPLY VOLTAGE-NOM (VSUP):  4 V

SURFACE MOUNT:  YES

TEMPERATURE GRADE:  INDUSTRIAL

TERMINAL FINISH:  TIN/LEAD (SN/PB)

TERMINAL FORM:  GULL WING

TERMINAL PITCH:  650 ΜM

TERMINAL POSITION:  DUAL

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  30

WIDTH:  5.6 MM

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