MC74LCX16373DTR2
TSSOP, TSSOP48,.3,20Call for availability
Mfr Part#: MC74LCX16373DTR2
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP48,.3,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.3,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
FAMILY: LVC/LCX/Z
JESD-30 CODE: R-PDSO-G48
JESD-609 CODE: E0
LENGTH: 12.5 MM
LOAD CAPACITANCE (CL): 50 PF
LOGIC IC TYPE: BUS DRIVER
MANUFACTURER: ON SEMICONDUCTOR
MANUFACTURER PART NUMBER: MC74LCX16373DTR2
MAX I(OL): 24 MA
NUMBER OF BITS: 8
NUMBER OF FUNCTIONS: 2
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 48
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CHARACTERISTICS: 3-STATE
OUTPUT POLARITY: TRUE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP48,.3,20
PACKAGE EQUIVALENCE CODE: TSSOP48,.3,20
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSSOP
PEAK REFLOW TEMPERATURE (CEL): 240
PIN COUNT: 48
POWER SUPPLIES: 3.3 V
PROP. DELAY@NOM-SUP: 5.4 NS
PROPAGATION DELAY (TPD): 6.6 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.1 MM
SUBCATEGORY: FF/LATCHES
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 2 V
SUPPLY VOLTAGE-NOM (VSUP): 2.5 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: TIN/LEAD (SN90PB10)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 500 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 30
WIDTH: 6.1 MM
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