MC74LVXC3245DTRG
TSSOP, TSSOP24,.25Call for availability
Mfr Part#: MC74LVXC3245DTRG
MANUFACTURER PACKAGE CODE: 948H-01
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP24,.25
PACKAGE EQUIVALENCE CODE: TSSOP24,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSSOP
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ADDITIONAL FEATURE: 3.3V SUPPLY FOR PORT A; 5V SUPPLY FOR PORT B
BRAND NAME: ON SEMICONDUCTOR
CONTROL TYPE: COMMON CONTROL
COUNT DIRECTION: BIDIRECTIONAL
FAMILY: LV/LV-A/LVX/H
JESD-30 CODE: R-PDSO-G24
JESD-609 CODE: E4
LENGTH: 7.8 MM
LOGIC IC TYPE: BUS TRANSCEIVER
MANUFACTURER: ON SEMICONDUCTOR
MANUFACTURER PACKAGE CODE: 948H-01
MANUFACTURER PART NUMBER: MC74LVXC3245DTRG
MAX I(OL): 24 MA
NUMBER OF BITS: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 2
NUMBER OF TERMINALS: 24
OPERATING TEMPERATURE-MAX: 85 °C
OPERATING TEMPERATURE-MIN: -40 °C
OUTPUT CHARACTERISTICS: 3-STATE
OUTPUT POLARITY: TRUE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TSSOP
PACKAGE DESCRIPTION: TSSOP, TSSOP24,.25
PACKAGE EQUIVALENCE CODE: TSSOP24,.25
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
PACKING METHOD: TAPE AND REEL
PART PACKAGE CODE: TSSOP
PBFREE CODE: YES
PEAK REFLOW TEMPERATURE (CEL): 260
PIN COUNT: 24
POWER SUPPLIES: 2.5/3.3,3.3/5 V
PROP. DELAY@NOM-SUP: 9 NS
PROPAGATION DELAY (TPD): 9 NS
QUALIFICATION STATUS: NOT QUALIFIED
SEATED HEIGHT-MAX: 1.2 MM
SUBCATEGORY: BUS DRIVER/TRANSCEIVERS
SUPPLY VOLTAGE-MAX (VSUP): 3.6 V
SUPPLY VOLTAGE-MIN (VSUP): 2.3 V
SUPPLY VOLTAGE-NOM (VSUP): 3.3 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TEMPERATURE GRADE: INDUSTRIAL
TERMINAL FINISH: NICKEL/PALLADIUM/GOLD (NI/PD/AU)
TERMINAL FORM: GULL WING
TERMINAL PITCH: 650 ΜM
TERMINAL POSITION: DUAL
TIME@PEAK REFLOW TEMPERATURE-MAX (S): 40
TRANSLATION: 3V & 3/5V
WIDTH: 4.4 MM
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