ACCESS MODE:  FOUR BANK PAGE BURST

ACCESS TIME-MAX:  600 PS

ADDITIONAL FEATURE:  AUTO/SELF REFRESH

CLOCK FREQUENCY-MAX (FCLK):  200 MHZ

I/O TYPE:  COMMON

INTERLEAVED BURST LENGTH:  4,8

JESD-30 CODE:  R-PBGA-B60

LENGTH:  10.5 MM

MANUFACTURER:  QIMONDA AG

MANUFACTURER PART NUMBER:  HYB18T512800AF-5

MEMORY DENSITY:  536.8709 MBIT

MEMORY IC TYPE:  DDR DRAM

MEMORY WIDTH:  8

MOISTURE SENSITIVITY LEVEL:  3

NUMBER OF FUNCTIONS:  1

NUMBER OF PORTS:  1

NUMBER OF TERMINALS:  60

NUMBER OF WORDS:  67.1089 M

NUMBER OF WORDS CODE:  64000000

OPERATING MODE:  SYNCHRONOUS

OPERATING TEMPERATURE-MAX:  95 °C

OPERATING TEMPERATURE-MIN:  0 °C

ORGANIZATION:  64MX8

OUTPUT CHARACTERISTICS:  3-STATE

PACKAGE BODY MATERIAL:  PLASTIC/EPOXY

PACKAGE CODE:  TFBGA

PACKAGE DESCRIPTION:  TFBGA, BGA60,9X11,32

PACKAGE EQUIVALENCE CODE:  BGA60,9X11,32

PACKAGE SHAPE:  RECTANGULAR

PACKAGE STYLE:  GRID ARRAY, THIN PROFILE, FINE PITCH

PART PACKAGE CODE:  BGA

PEAK REFLOW TEMPERATURE (CEL):  260

PIN COUNT:  60

POWER SUPPLIES:  1.8 V

QUALIFICATION STATUS:  NOT QUALIFIED

REFRESH CYCLES:  8192

SEATED HEIGHT-MAX:  1.2 MM

SEQUENTIAL BURST LENGTH:  4,8

STANDBY CURRENT-MAX:  4 MA

SUBCATEGORY:  DRAMS

SUPPLY VOLTAGE-MAX (VSUP):  1.9 V

SUPPLY VOLTAGE-MIN (VSUP):  1.7 V

SUPPLY VOLTAGE-NOM (VSUP):  1.8 V

SURFACE MOUNT:  YES

TECHNOLOGY:  CMOS

TEMPERATURE GRADE:  OTHER

TERMINAL FORM:  BALL

TERMINAL PITCH:  800 ΜM

TERMINAL POSITION:  BOTTOM

TIME@PEAK REFLOW TEMPERATURE-MAX (S):  40

WIDTH:  10 MM