HYB18TC1G800AF-3.7
TFBGA, BGA68,9X19,32Call for availability
Mfr Part#: HYB18TC1G800AF-3.7
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA68,9X19,32
PACKAGE EQUIVALENCE CODE: BGA68,9X19,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
Availability
Qty in Stock: Call for availability
Min. Order Qty: 1
ACCESS MODE: MULTI BANK PAGE BURST
ACCESS TIME-MAX: 500 PS
ADDITIONAL FEATURE: AUTO/SELF REFRESH
CLOCK FREQUENCY-MAX (FCLK): 266 MHZ
I/O TYPE: COMMON
INTERLEAVED BURST LENGTH: 4,8
JESD-30 CODE: R-PBGA-B92
LENGTH: 20 MM
MANUFACTURER: QIMONDA AG
MANUFACTURER PART NUMBER: HYB18TC1G800AF-3.7
MEMORY DENSITY: 1.0737 GBIT
MEMORY IC TYPE: DDR DRAM
MEMORY WIDTH: 8
NUMBER OF FUNCTIONS: 1
NUMBER OF PORTS: 1
NUMBER OF TERMINALS: 92
NUMBER OF WORDS: 134.2177 M
NUMBER OF WORDS CODE: 128000000
OPERATING MODE: SYNCHRONOUS
ORGANIZATION: 128MX8
OUTPUT CHARACTERISTICS: 3-STATE
PACKAGE BODY MATERIAL: PLASTIC/EPOXY
PACKAGE CODE: TFBGA
PACKAGE DESCRIPTION: TFBGA, BGA68,9X19,32
PACKAGE EQUIVALENCE CODE: BGA68,9X19,32
PACKAGE SHAPE: RECTANGULAR
PACKAGE STYLE: GRID ARRAY, THIN PROFILE, FINE PITCH
PART PACKAGE CODE: BGA
PIN COUNT: 92
POWER SUPPLIES: 1.8 V
QUALIFICATION STATUS: NOT QUALIFIED
REFRESH CYCLES: 8192
SEATED HEIGHT-MAX: 1.2 MM
SEQUENTIAL BURST LENGTH: 4,8
SUBCATEGORY: DRAMS
SUPPLY VOLTAGE-MAX (VSUP): 1.9 V
SUPPLY VOLTAGE-MIN (VSUP): 1.7 V
SUPPLY VOLTAGE-NOM (VSUP): 1.8 V
SURFACE MOUNT: YES
TECHNOLOGY: CMOS
TERMINAL FORM: BALL
TERMINAL PITCH: 800 ΜM
TERMINAL POSITION: BOTTOM
WIDTH: 10 MM
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